Aviso: Você está editando um guia tipo pré-requisito. Todas as alterações que você fizer afetarão todos os 20 guias que incluem este passo.
Traduzindo o passo 3
Passo 3
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Insert a spudger underneath the shield plate along the edge of the device.
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Pry up to lift the shield plate and remove it from the device.
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You can reuse the pink thermal compound if you're careful. Keep the compound clean and make sure it makes solid contact between the heat sink and the shield during reassembly.
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If you need to replace it, refer to our thermal paste guide to remove the old thermal compound and replace it with an appropriate compound, such as K5 Pro, during reassembly.
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