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Passo 3
Insert a spudger underneath the shield plate along the edge of the device. Pry up to lift the shield plate up. You may feel a bit of resistance. This is normal, since the shield plate is slightly bonded to the heat sink with thermal paste.
  • Insert a spudger underneath the shield plate along the edge of the device.

  • Pry up to lift the shield plate up.

  • You may feel a bit of resistance. This is normal, since the shield plate is slightly bonded to the heat sink with thermal paste.

  • Remove the shield plate.

  • A thick pink thermal compound bridges the gap between the shield plate and the copper heat sink underneath. For best results, whenever the shield plate is removed, refer to our thermal paste guide to remove the old thermal compound and replace it with an appropriate, thick compound such as K5 Pro during reassembly.

Insérez une spatule (spudger) sous la plaque de protection, le long du bord de l'appareil.

Soulevez la plaque de protection.

Vous pouvez ressentir un peu de résistance. Ceci est normal, car la plaque de protection est légèrement collée au dissipateur thermique avec de la pâte thermique.

Retirez la plaque de protection.

De la pâte thermique épaisse rose comble l'espace entre la plaque de protection et le dissipateur thermique en cuivre en dessous. Pour de meilleurs résultats, chaque fois que la plaque de protection est retirée, reportez-vous à notre tutoriel de pâte thermique pour retirer l'ancienne pâte thermique et la remplacer par une pâte épaisse appropriée comme la K5 Pro lors du remontage.

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