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Passo 2
Remove the shield plate from the device. A thick pink thermal compound bridges the gap between the shield plate and the copper heat sink underneath. For best results, whenever the shield plate is removed, refer to our thermal paste guide to remove the old thermal compound and replace it with an appropriate, thick compound such as K5 Pro during reassembly. A thick pink thermal compound bridges the gap between the shield plate and the copper heat sink underneath. For best results, whenever the shield plate is removed, refer to our thermal paste guide to remove the old thermal compound and replace it with an appropriate, thick compound such as K5 Pro during reassembly.
  • Remove the shield plate from the device.

  • A thick pink thermal compound bridges the gap between the shield plate and the copper heat sink underneath. For best results, whenever the shield plate is removed, refer to our thermal paste guide to remove the old thermal compound and replace it with an appropriate, thick compound such as K5 Pro during reassembly.

Retirez la plaque de protection de l'appareil.

De la pâte thermique rose et épaisse relie la plaque de protection au dissipateur thermique en cuivre situé en dessous. Si vous avez démonté celle-ci et voulez obtenir de meilleurs résultats lors du remontage, consultez notre tutoriel de pose de pâte thermique pour retirer l’ancien composé thermique et poser une nouvelle couche, de K5 Pro par exemple.

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