Alterações no passo nº 5
Linhas do passo
| + | [* black] Remove tin on the bonding pad with Soldering Iron at 365 °C and Solder Wick. |
|---|---|
| + | [* black] Tin on the bonding pad must be completely removed. The residual tin will affect the subsequent soldering. |
| + | [* black] Clean the bonding pad with PCB Cleaner. |
| + | [* black] Clean the logic board with the same method. Please do not damage components around the bonding pad of the logic board while cleaning. It is necessary to check if the bonding pad is neat after cleaning. |
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