Ir para o conteúdo principal
Ajuda

iPhone X-12 Double-stacked Board Separation & Recombination Tips

Editando passo 2 —

Tipo de Passo:

Arraste para reorganizar

The logic board and middle layer are soldered with low-temperature solder paste. So the best temperature for the heating platform will be 155 °C-165 °C.

Push the logic board gently with tweezers when the temperature reaches 165 °C. If the logic board is loose, the tin has melted.

Suas contribuições são licenciadas pela licença de código aberto Creative Commons.