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It is not PoP package(Package-on-Package) . From the photo of A12X, it should not be PoP package(processor is next to two memory chips). Is that TSMC’s InFo or CoWos package technology?
HBM can provide higher BW. But, from power consumption, most likely, it can not be. LPDDR4x can provide lower power consumption menory solution for mobile devices, such as iPad.
Qualcomm chip provides GNSS(GPS) feature. It is not necessary to use discrete chip for GPS.
Not DDR3 but LPDDR3. It is limited by intel processor which supports LPDDR3 and DDR4 only. intel processor does not support LPDDR4x.
Dialog used to provide PMIC for Apple iPhone, iPad, Apple TV and iPod. Apple processor-based system always uses Dialog’s PMIC solution. But, from iPhone XS Max, seems, Apple starts to uses its own design on PMIC just as Dialog said that before. refer to https://www.eetimes.com/document.asp?doc...
Is 338S00540 (XS Max) WiFi/Bluetooth module from Murata?
intel modem supports GNSS feature. It won’t have discrete GNSS chip in the iPhone XS.
@repoman27 i talked to Apple store employee. The SSD module used in the Apple iMac Pro can be replaced by other PCIe SSD(Apple does not recommend doing that) and the employee said it is PCIe interface which means it can not be typical NAND interface.
This is an example of BGA SSD on M.2 module https://www.anandtech.com/show/12819/the...
The T2 processor should not be NAND Flash controller here. T2 is more like a RAID controller. Refer to https://duo.com/blog/apple-imac-pro-and-... The Toshiba chip here could be a PCIe/NVMe SSD in BGA chip package(like the one in the iPhone/iPad). The physical interface between T2 and Toshiba chip could be PCIe interface. T2 processor is also used to replace TI’s SMC controller.
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