Alterações no passo nº 9
Edição por Jeff Suovanen —
Edição aprovada por Jeff Suovanen
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Linhas do passo
| [* black] Use a soft brush (like a toothbrush or [product|IF145-062-1|detailing brush|new_window=true]) to gently scrub away any corrosion and liquid residue on the logic board and other components. | |
| [* icon_caution] It's possible to break small solder joints with too much force from the brush. Use just enough force to remove the corrosion and residue. | |
| - | [* icon_note] Pay special attention to cable ends, battery contacts, connectors, pins, and fuses as these parts are prone to corrosion and can easily cause the phone to malfunction. |
| + | [* icon_note] Pay special attention to cable ends, battery contacts, connectors, pins, and fuses, as these parts are prone to corrosion and can easily cause the phone to malfunction. |
| [* black] Keep the logic board and any other alcohol-covered components over a cloth. There's a chance the alcohol can damage or mark your work surface. | |
| [* black] If needed, repeat steps 8 and 9 until all corrosion and residue is gone. |