Alterações no passo nº 7
Edição por Jeff Suovanen —
Edição aprovada por Jeff Suovanen
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- | [* black] The motherboard pops out with relative ease, giving us a peep at that now-Samsung-standard heatpipe. |
+ | [* black] The I/O board connector is ''under'' the motherboard in these late-model Galaxy phones. Because why not make things harder? |
+ | [* black] The motherboard itself pops out with relative ease, giving us a peep at that now-Samsung-standard heatpipe. |
[* black] The I/O daughterboard configuration matches the S8+ right down to the modular headphone jack. | |
- | [* icon_note] Since we've already gone through the camera shenanigans, let's |
+ | [* icon_note] Since we've already gone through the camera shenanigans, let's get straight to the chips. |