Alterações no passo nº 9
Edição por Jeff Suovanen —
Edição aprovada por Jeff Suovanen
- Antes
- Depois
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Linhas do passo
| - | [* red] Samsung [http://www.samsung.com/semiconductor/products/dram/mobile-dram/low-power-ddr4x/K3UH5H50MM-NGCJ?ia=3157|K3UH5H50MM-NGCJ] 4 GB LPDDR4 RAM layered over the [https://www.qualcomm.com/products/snapdragon/processors/835|MSM8998|new_window=true] Snapdragon 835 |
|---|---|
| - | [* orange] Toshiba [https://toshiba.semicon-storage.com/eu/product/memory/nand-flash/mlc-nand/ufs.html|THGAF4G9N4LBAIR|new_window=true] 64 GB UFS (NAND flash + controller) |
| - | [* yellow] Qualcomm Aqstic [https://www.qualcomm.com/news/releases/2017/01/03/qualcomm-snapdragon-835-mobile-platform-power-next-generation-immersive|WCD9341|new_window=true] audio codec |
| - | [* green] Skyworks 78160-11 |
| - | [* light_blue] Avago AFEM-9066 |
| + | [* black] We push the cameras off to the side in order to pore over this motherboard's silicon. Our findings include: |
| + | [* red] Samsung [http://www.samsung.com/semiconductor/products/dram/mobile-dram/low-power-ddr4x/K3UH5H50MM-NGCJ?ia=3157|K3UH5H50MM-NGCJ] 4 GB LPDDR4 RAM layered over the [https://www.qualcomm.com/products/snapdragon/processors/835|MSM8998|new_window=true] Snapdragon 835 |
| + | [* orange] Toshiba [https://toshiba.semicon-storage.com/eu/product/memory/nand-flash/mlc-nand/ufs.html|THGAF4G9N4LBAIR|new_window=true] 64 GB UFS (NAND flash + controller) |
| + | [* yellow] Qualcomm Aqstic [https://www.qualcomm.com/news/releases/2017/01/03/qualcomm-snapdragon-835-mobile-platform-power-next-generation-immersive|WCD9341|new_window=true] audio codec |
| + | [* green] Skyworks 78160-11 |
| + | [* light_blue] Avago AFEM-9066 |