Alterações no passo nº 12
Edição por Arthur Shi —
Edição aprovada por Arthur Shi
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| [* black] With both motherboards out, we find another sandwich! This time it's the main CPU/memory heatsink, and we're eager to dive into its many layers. | |
| [* icon_note] Each layer is stuck together with thermal paste to aid heat transfer through the layers. | |
| - | [* black] The outer layer contains the heat sink fins. They bring the heat up from the copper plate to be blown away by the fan. |
| + | [* black] From left to right: |
| + | [* black] The outer layer contains the heat sink fins. They transfer heat up from the copper plate/vapor chamber to be wicked away by cool air. |
| + | [* black] Next up—a metal bracket. Combined with the copper plate, it acts as an EM shield for the motherboard. There's a strip of thermal putty (not sure what the proper term is) that transfers heat from the row of power MOSFETS on the motherboard to the frame. |
| + | [* black] The "CCS" (as Microsoft labels it) Center Chassis—provides rigidity, sinks heat, and maximizes board coolification |
| + | [* black] A Faraday cage/EM shield that protects the other motherboard. |