Pular para o conteúdo principal

Peças

Nenhum componente especificado.

  1. Remove the ribbon wires connecting to the screen using the pry tool.
    • Remove the ribbon wires connecting to the screen using the pry tool.

  2. 2 tabs hold the motherboard in place.
    • 2 tabs hold the motherboard in place.

    • Release the labeled tabs with the pry tool from the location shown.

  3. Separate the motherboard from the phone.
    • Separate the motherboard from the phone.

  4. Key pad is readily removable.
    • Key pad is readily removable.

    • A view of the mother board with keys, keypad, and the phone's body.

Conclusão

To reassemble your device, follow these instructions in reverse order.

Matthew Hove

Membro desde: 05-01-2011

1.031 reputação

10 Guias de autoria

Equipe

Cal Poly, Team 3-40, Regan Winter 2011 Membro de Cal Poly, Team 3-40, Regan Winter 2011

CPSU-REGAN-W11S3G40

4 Membros

20 Guias de autoria

Adicionar comentário

Visualizar Estatísticas:

Últimas 24 horas: 0

Últimos 7 dias: 0

Últimos 30 dias: 0

Todo: 981