HTC One S Headphone Jack Replacement

Introdução

This guide provides step-by-step instructions for replacing the headphone jack on the HTC One S. Intermediate soldering skills are required to remove the component.

O que você precisa

Passo 1 iOpener Heating

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We recommend that you clean your microwave before proceeding, as any nasty gunk on the bottom may end up stuck to the iOpener.
Place the iOpener in the center of the microwave.
For carousel microwaves: Make sure the plate spins freely. If your iOpener gets stuck, it may overheat and burn.

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Passo 2

Heat the iOpener for thirty seconds.
Throughout the repair procedure, as the iOpener cools, reheat it in the microwave for an additional thirty seconds at a time.
Be careful not to overheat the iOpener during the repair. Overheating may cause the iOpener to burst.
Never touch the iOpener if it appears swollen.
If the iOpener is still too hot in the middle to touch, continue using it while waiting for it to cool down some more before reheating. A properly heated iOpener should stay warm for up to 10 minutes.

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Passo 3

Remove the iOpener from the microwave, holding it by one of the two flat ends to avoid the hot center.
The iOpener will be very hot, so be careful when handling it. Use an oven mitt if necessary.

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Passo 4 Alternate iOpener heating method

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If you don't have a microwave, follow this step to heat your iOpener in boiling water.
Fill a pot or pan with enough water to fully submerge an iOpener.
Heat the water to a boil. Turn off the heat.
Place an iOpener into the hot water for 2-3 minutes. Make sure the iOpener is fully submerged in the water.
Use tongs to extract the heated iOpener from the hot water.
Thoroughly dry the iOpener with a towel.
The iOpener will be very hot, so be careful to hold it only by the end tabs.
Your iOpener is ready for use! If you need to reheat the iOpener, heat the water to a boil, turn off the heat, and place the iOpener in the water for 2-3 minutes.

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Passo 5 Rear Case

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Handling it by the tag, place the heated iOpener across the bottom casing.
Let the iOpener sit for at least a minute to soften the adhesive beneath the casing.

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Passo 6

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Gently place an opening pick in the corner of the gap between the bottom casing and rear case.
Slide the opening pick along the side of the casing, prying it away from the adhesive as you go.

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Passo 7

Use your fingers to pull the bottom casing off the rest of the phone.

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Passo 8

Starting at the groove near the headphone jack, use a plastic opening tool to lift the top casing.

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Passo 9

Use your fingers to pull the top casing off of the rest of the phone.

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Passo 10

Remove the following screws holding the rear case to the rest of the phone:
Two 3.15 mm Phillips #00 screws
One 4.15 Torx T5 screw
One 4 mm Torx T5 screw

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Passo 11

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Place your fingers on either side of the phone and gently push up on the rear case.
It is important to start from the bottom of the phone because the rear case wraps around the front of the phone at the top which makes it impossible to start prying from there.

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Passo 12

Pull the rear case away from the rest of the phone with your hands.

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Passo 13 Battery

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Using the pointed end of a spudger, lift the battery cable and release the connector.

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Passo 14

Switching to the flat end of the spudger, work your way underneath the battery and peel it away from the adhesive.

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Passo 15

Remove the battery from the phone.

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Passo 16 Motherboard

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Remove the three 3.15mm Phillips #00 screws from the turquoise case.

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Passo 17

Using a plastic opening tool, lift the turquoise case from the end near the headphone jack.

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Passo 18

Remove the turquoise cover from the phone.

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Passo 19

A camera filter is now free to move, so remove it using tweezers.

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Passo 20

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Use tweezers to lift the yellow polyimide tape that covers the ZIF connectors.

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Passo 21

Use the pointed end of a spudger to lift the white tab on the largest ZIF connector opposite the USB connector.

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Passo 22

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Use the pointed edge of a spudger to work the ZIF cable out of its connector.
To do this, you may have to slowly work both sides until the whole cable is released.

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Passo 23

Repeat the procedure from steps 19 and 20 to remove the cables from the remaining ZIF connectors.

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Passo 24

Using the pointed end of the spudger, pop the antenna cable from its connector on the motherboard.

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Passo 25

Remove the 3.15 mm Phillips #00 screw from the motherboard.

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Passo 26

Remove the motherboard from the rest of the phone.

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Passo 27 Headphone Jack

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Using tweezers, remove the adhesive tape around the headphone jack.

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Passo 28

Using a soldering iron set at 400 degrees Celsius (752 degrees Fahrenheit), heat the solder joints lateral to the headphone jack. Use a pair of tweezers to lift the headphone jack from the board.
Extreme caution should be taken when working with high-temperature equipment to reduce the chance of burns.
It is strongly recommended that this guide on desoldering surface-mounted components is referenced before proceeding.