I think it might be fine/preferable to leave/reuse the purple goop between the heatpipe and the topmost shield, as that seems to be quite a bit more spreadable than usual thermal paste used on computers.
For the blue/greyish goop between the heatsink and the SoC shield, and between the SoC shield and the SoC, you might be able to scoop up some of the excess goop that seeped out that are still kinda liquid, and slap it back on to the chip die and copper part of the shield. Though decent thermal paste aren’t all that expensive.
Only those are the chips. The non covered part is the PCB substrate
not all microcontrollers have an OS.
Likely just a bootloader inside
any possibility of pushing the internal out from the tip?
now post some glass only repair videos instead of just talking about fused screens. Come on you already posted microsoldering videos...
So is it actual E-paper that uses E-ink capsules like Amazon kindle, or low power LCD?
how dors magnet dissipate heat?
If it's step 25, I think that's a PCB, not a coil. Those holes might be vias.
just habe to use heat to soften the OCA glue and cut through the glue with a thin strong wire
it's time to have guides on unfusing the display and glass cover panel, since so many displays are now fused.
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