Pular para o conteúdo principal
Ajuda
Editando passo 19 —

Tipo de Passo:

Arraste para reorganizar

So many chips…where's the dip?:

Skyworks 77449 Power Amplifier Module for LTE/EUTRAN Bands XIII/XIV

Toshiba Y9A0A111308LA Memory Stack

ST Ericsson CPCAP 6556002

Hynix H90H1GH51JMP (similar to other devices we've seen, this POP chip sits on top of the TI OMAP 4430 processor)

Infineon 5726 SLU A1 H1118 3A126586

Bosch 2133 C3H L1ABG accelerometer

And the back of the board? Even the PCB is stepped with a cavity to recess the flex wrap from back to front. Nothing spared in the pursuit of ultimate thinness.

Suas contribuições são licenciadas pela licença de código aberto Creative Commons.