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Editando passo 4 —

Tipo de Passo:

Arraste para reorganizar

The second half of the outer casing is removed to isolate the board. Note the white paste on the board used to thermally isolate the components.

The second picture shows the bottom of the circuit board (left) after removing the support (right). Here, too, we see use of paste but for the purpose of binding the support and circuit.

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