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Passo 14
We smell chips! With the motherboard free and the EMI shielding pulled away, it's time for a look at the silicon:
  • We smell chips! With the motherboard free and the EMI shielding pulled away, it's time for a look at the silicon:

  • Micron MT53B384M64D4NK-062 3 GB LPDDR4 RAM, layered over Qualcomm Snapdragon 810 v2.1, 2.0 GHz octa-core 64-bit CPU

  • Samsung KLMBG4GEND-B031 32 GB eMMC 5.0 NAND Flash

  • Qualcomm PMI8994 Power Management IC (found in many 2015 Android smartphones including the Nexus 5X)

  • Qualcomm SMB1351 Quick Charge IC (Likely an iteration of SMB1358 found in the Nexus 5X)

  • Qualcomm QFE1100 Envelope Tracking IC

  • ST Microelectronics STM32F411CE 32-bit 100 MHz ARM Cortex-M4 RISC microcontroller

  • Maxim Integrated MAX98925 Audio Amplifier

Nous flairons les chips ! Une fois la carte mère dégagée et le blindage électromagnétique mis de côté, il est temps d'admirer le silicium :

RAM de 3 Go Micron MT53B384M64D4NK-062, posée au dessus d'un CPU Qualcomm Snapdragon 810 v2.1, 2.0 GHz octo-core de 64-bit

Mémoire flash NAND Samsung KLMBG4GEND-B031 de 32 Go eMMC 5.0

IC gestion d'alimentation Qualcomm PMI8994 (trouvé sur plusieurs smartphones Android dont le Nexus 5X)

IC recharge rapide Qualcomm SMB1351 (ressemble à une itération du SMB1358 trouvé sur le Nexus 5X)

IC Envelope Tracking Qualcomm QFE1100

Microcontrôleur ST Microelectronics STM32F411CE 32-bit 100 MHz ARM Cortex-M4 RISC

Amplificateur audio Maxim Integrated MAX98925

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