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Passo 8
With all shields down, we can get a better look at the silicon hiding beneath:
  • With all shields down, we can get a better look at the silicon hiding beneath:

  • Samsung K3LK4K40BM-BGCN 12 GB LPDDR5 RAM layered over Qualcomm 865 SoC

  • Samsung KLUDG4UHDB-B2D1 128 GB UFS 3.0 flash storage

  • Qualcomm SDX55M 2nd-gen 5G modem

  • Skyworks SKY58210-11 RF Front-End Module

  • Qorvo QM78092 Front-End Module

  • Maxim MAX77705C power management IC

  • Qualcomm QPM5677 and QPM6585 5G power amplification modules

Jetzt können wir das Silizium, das sich darunter versteckt, besser sehen:

Samsung K3LK4K40BM-BGCN 12 GB LPDDR5 RAM über einem Qualcomm 865 SoC

Samsung KLUDG4UHDB-B2D1 128 GB UFS 3.0 Flash-Speicher

Qualcomm SDX55M 5G Modem der 2. Generation

Skyworks SKY58210-11 RF Frontend Modul

Qorvo QM78092 Frontend Modul

Maxim MAX77705C Power Management IC

Qualcomm QPM5677 und QPM6585 5G Leistungsverstärker-Module

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