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Passo 9
Thermal pads and cameras aside, let's get to those chips! On the front side of these motherboards (top: S10e, bottom: S10), we spot:
  • Thermal pads and cameras aside, let's get to those chips! On the front side of these motherboards (top: S10e, bottom: S10), we spot:

  • S10e: THGAF8T0T43BAIR 128 GB Toshiba UFS NAND flash storage

  • S10: KLUFG8R1EM-B0C1 512 GB Samsung eUFS NAND flash storage

  • Samsung K3UH7H70AM-AGCL LPDDR4X layered over Qualcomm Snapdragon 855 SoC

  • Qualcomm WCD9341 audio codec

  • Qorvo QM78062, likely a RF Fusion front-end module

  • Maxim MAX77705C PMIC

  • Skyworks SKY78160-51 Low Noise Amplifier

除了这些散热垫和相机,还有很多芯片值得一看,正面主板如下(上方:S10e,下方:S10)如下列表:

S10e:东芝(Toshiba)UFS NAND闪存

S10:三星(Samsung)eUFS NAND闪存

三星(Samsung)K3UH7H70AMLPDDR4X内存堆叠封装在高通骁龙(Qualcomm Snapdragon)855 SoC之上

高通(Qualcomm)WCD9341音频编解码器

Qorvo 78062 可能是射频融合前端模块

美信(Maxim)MAX77705C 电源管理集成电路

思佳讯(Skyworks)78160-5

[* black] Thermal pads and cameras aside, let's get to those chips! On the front side of these motherboards (top: S10e, bottom: S10), we spot:
- [* red] S10e: 128 GB [https://business.toshiba-memory.com/en-us/product/memory/mlc-nand/ufs.html|Toshiba|new_window=true] UFS NAND flash storage
- [* red] S10: 512 GB [https://www.samsung.com/semiconductor/estorage/eufs/KLUFG8R1EM-B0C1/|Samsung|new_window=true] eUFS NAND flash storage
- [* orange] Samsung [https://www.samsung.com/semiconductor/dram/lpddr4x/K3UH7H70AM-AGCL/|K3UH7H70AM|new_window=true] LPDDR4X layered over Qualcomm [https://www.qualcomm.com/products/snapdragon-855-mobile-platform|Snapdragon 855|new_window=true] SoC
+ [* red] S10e: THGAF8T0T43BAIR 128 GB [https://business.toshiba-memory.com/en-us/product/memory/mlc-nand/ufs.html|Toshiba|new_window=true] UFS NAND flash storage
+ [* red] S10: KLUFG8R1EM-B0C1 512 GB [https://www.samsung.com/semiconductor/estorage/eufs/KLUFG8R1EM-B0C1/|Samsung|new_window=true] eUFS NAND flash storage
+ [* orange] Samsung [https://www.samsung.com/semiconductor/dram/lpddr4x/K3UH7H70AM-AGCL/|K3UH7H70AM-AGCL|new_window=true] LPDDR4X layered over Qualcomm [https://www.qualcomm.com/products/snapdragon-855-mobile-platform|Snapdragon 855|new_window=true] SoC
[* yellow] Qualcomm [https://www.qualcomm.com/products/wcd9341|WCD9341|new_window=true] audio codec
- [* green] Qorvo 78062, likely a [https://www.qorvo.com/applications/mobile-products/rf-fusion|RF Fusion|new_window=true] front-end module
+ [* green] Qorvo QM78062, likely a [https://www.qorvo.com/applications/mobile-products/rf-fusion|RF Fusion|new_window=true] front-end module
[* light_blue] Maxim MAX77705C PMIC
- [* blue] Skyworks 78160-5
+ [* blue] Skyworks [link|https://store.skyworksinc.com/products/detail/sky7816051-skyworks/625141/|SKY78160-51|new_window=true] Low Noise Amplifier

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