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Passo 3
Insert a spudger underneath the shield plate along the edge of the device. Pry up to lift the shield plate up. You may feel a bit of resistance. This is normal, since the shield plate is slightly bonded to the heat sink with thermal paste.
  • Insert a spudger underneath the shield plate along the edge of the device.

  • Pry up to lift the shield plate up.

  • You may feel a bit of resistance. This is normal, since the shield plate is slightly bonded to the heat sink with thermal paste.

  • Remove the shield plate.

  • A thick pink thermal compound bridges the gap between the shield plate and the copper heat sink underneath. For best results, whenever the shield plate is removed, refer to our thermal paste guide to remove the old thermal compound and replace it with an appropriate, thick compound such as K5 Pro during reassembly.

在设备的侧面,用塑料撬棍撬起屏蔽罩

在铜质热管和屏蔽罩之间涂有一层较厚的粉色导热硅脂。为了最好的散热效果,在移除屏蔽罩之后,最好参考我们的散热硅脂更换指南来移除旧的散热硅脂并为其更换合适厚度的硅脂,例如K5 Pro

[* black] Insert a spudger underneath the shield plate along the edge of the device.
[* icon_reminder] Pry up to lift the shield plate up.
[* icon_note] You may feel a bit of resistance. This is normal, since the shield plate is slightly bonded to the heat sink with thermal paste.
[* black] Remove the shield plate.
[* icon_reminder] Clean offA thick pink thermal compound bridges the old thermal paste fromgap between the shield plate and the copper heat sink using high-concentration (90% or higher) isopropyl alcohol and a microfiber cloth. [guide|744|Apply new thermal paste|new_window=trueunderneath. For best results, whenever the shield plate is removed, refer to our [guide|744|thermal paste guide|new_window=true] to remove the heat sink beforeold thermal compound and replace it with an appropriate, thick compound such as [https://www.amazon.com/viscous-thermal-paste-replacement-Aspire/dp/B01GQ7TFTM/ref=sr_1_4?ie=UTF8&qid=1508975365&sr=8-4&keywords=k5+pro&tag=ifixitam-20|K5 Pro|new_window=true] during reassembly.
[* icon_reminder] Clean offA thick pink thermal compound bridges the old thermal paste fromgap between the shield plate and the copper heat sink using high-concentration (90% or higher) isopropyl alcohol and a microfiber cloth. [guide|744|Apply new thermal paste|new_window=trueunderneath. For best results, whenever the shield plate is removed, refer to our [guide|744|thermal paste guide|new_window=true] to remove the heat sink beforeold thermal compound and replace it with an appropriate, thick compound such as [https://www.amazon.com/viscous-thermal-paste-replacement-Aspire/dp/B01GQ7TFTM/ref=sr_1_4?ie=UTF8&qid=1508975365&sr=8-4&keywords=k5+pro&tag=ifixitam-20|K5 Pro|new_window=true] during reassembly.

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