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Passo 2
Remove the shield plate from the device. A thick pink thermal compound bridges the gap between the shield plate and the copper heat sink underneath. For best results, whenever the shield plate is removed, refer to our thermal paste guide to remove the old thermal compound and replace it with an appropriate, thick compound such as K5 Pro during reassembly. A thick pink thermal compound bridges the gap between the shield plate and the copper heat sink underneath. For best results, whenever the shield plate is removed, refer to our thermal paste guide to remove the old thermal compound and replace it with an appropriate, thick compound such as K5 Pro during reassembly.
  • Remove the shield plate from the device.

  • A thick pink thermal compound bridges the gap between the shield plate and the copper heat sink underneath. For best results, whenever the shield plate is removed, refer to our thermal paste guide to remove the old thermal compound and replace it with an appropriate, thick compound such as K5 Pro during reassembly.

Entferne das Abschirmblech vom Gerät.

Der Spalt zwischen dem Abschirmblech und dem kupfernen Kühlkörper wird durch eine dicke Schicht von pinkfarbener Wärmeleitpaste überbrückt. Unsere Anleitung für Wärmeleitpaste zeigt dir, wie du sie entfernen und durch neue Paste ersetzen kannst. Dafür eignet sich eine dicke Paste, wie z.B. K5 Pro.

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