Alterações no passo nº 4
Edição por Adam O'Camb —
Edição aprovada por Adam O'Camb
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| [* black] Waterproofing a smartphone means sealing up all of the ingress points. We find our first evidence of Google's efforts in a gasket on the SIM tray. | |
| [* icon_note] Not that this phone ''needs'' a physical [https://www.theverge.com/2017/10/4/16424740/google-pixel-2-xl-esim-technology-project-fi-first-ever|SIM card|new_window=true]. | |
| [* black] In a departure from standard smartphone opening procedure, we leave the iOpener behind today. The Pixel 2 employs a foam tape that can be separated without applying heat. | |
| [* black] Inside we find long cables—a welcome respite from some treacherous openings with past [guide|17383|smartphones|stepid=52330|new_window=true]. | |
| - | [* icon_note] An ams likely [link|https://ams.com/tmd4903|TMD4903] color sensor module is found in the center of the back cover |
| + | [* icon_note] An ams chip, likely a [link|https://ams.com/tmd4903|TMD4903|new_window=true] color sensor module, is found in the center of the back cover. |