Alterações no passo nº 7
Edição por Neil Katin —
Edição recusada por Alex Diaz-Kokaisl
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| [* black] The I/O board connector is ''under'' the motherboard in these late-model Galaxy phones. Because why not make things harder? | |
| + | [* black] Remove the three RF connectors: one with a + on the connector at the bottom left of the motherboard; the other two are small u.FL coax connections (blue and white cable) |
| [* black] The motherboard itself pops out with relative ease, giving us a peep at that now-Samsung-standard heatpipe. | |
| [* black] The I/O daughterboard configuration matches the S8+ right down to the modular headphone jack. | |
| [* icon_note] Since we've already gone through the [guide|87086|camera shenanigans|stepid=164356|new_window=true], let's get straight to the chips. |