Alterações no passo nº 18
Edição por Andrew Optimus Goldheart —
Edição aprovada por Andrew Optimus Goldheart
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| [* black] Let us take a look at what silicon is so heavily guarded by the charging case: | |
| [* red] STMicroelectonics [http://www.st.com/en/microcontrollers/stm32l0x2.html?querycriteria=productId=LN1844|STM32L072|new_window=true] ARM [https://www.arm.com/products/processors/cortex-m/cortex-m0plus.php|Cortex-M0+|new_window=true] MCU | |
| - | [* icon_note] Our X-ray imagery shows some quality issues in this chip. Empty spaces, known as voiding, could be evidence of low quality standards, or a rushed product release. Could issues with the AirPod case be what delayed release? |
| + | [* icon_note] Our X-ray imagery shows some quality issues in this chip's solder joints. Empty spaces, known as voiding, could be evidence of low quality standards, or a rushed product release. Could issues with the AirPod case be what delayed release? |
| [* orange] NXP 1610A3 charging IC (as seen in iPhones 6s and SE and both iPad Pro models) | |
| [* yellow] Texas Instruments [http://www.ti.com/product/BQ24232?keyMatch=BQ24232&tisearch=Search-EN-Products|BQ24232|new_window=true] power management IC |