Alterações no passo nº 8
Edição por Paige Reisman —
Edição aprovada por Paige Reisman
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[* black] Next, we mine for Copper, extracting the shiny heat sink. | |
- | [* black] A |
+ | [* black] A tall standoff spacer, reminiscent of the [guide|19644|27" iMacs|stepid=49812|new_window=true], houses the screw holding this beast in place. |
[* black] From what we can tell, the heat sink appears to offer double the cooling power: | |
- | [* black] The black plastic portion of the assembly |
- | [* black] A heat pipe also connects the two |
+ | [* black] The black plastic portion of the assembly looks like a channel, directing airflow from the nearby fan through the radiator fins, and ultimately to each processor. |
+ | [* black] A heat pipe also connects the two halves of the assembly, allowing leveling and, probably, additional cooling. |
[* icon_note] It looks like Microsoft is getting quite a bit ''cooler'' than its [http://www.iospop.com/wp-content/uploads/2009/11/hodgman-improv-get-a-mac-ads.jpg|late 2000s reputation|new_window=true], if you know what we mean. |