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Alterações no passo #19

Edição por William Anderson

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[* black] So many chips…where's the dip?:
[* red] [http://www.skyworksinc.com/Product.aspx?ProductID=451|Skyworks 77449] Power Amplifier Module for LTE/EUTRAN Bands XIII/XIV
[* orange] [http://www2.electronicproducts.com/Motorola_Xoom_MZ600-whatsinside_text-111.aspx|Toshiba Y9A0A111308LA] Memory Stack
[* yellow] ST Ericsson CPCAP 6556002
[* green] Hynix H90H1GH51JMP (this is a package-on-package, or POP, chip which obscures the TI OMAP application processor SoC underneath)
[* green] Hynix H90H1GH51JMP (this is a package-on-package, or POP, chip which obscures the TI OMAP application processor SoC underneath)
[* blue] Infineon 5726 SLU A1 H1118 3A126586
[* violet] Bosch 2133 C3H L1ABG accelerometer
[* black] And the back of the board? Nothing of interest, which makes sense given how tightly packed the motherboard is to the display.