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Alterações no passo #17

Edição por Vincent Cheng

Edição aprovada por Kyle Wiens

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[* black] Alright, the moment we've all been waiting for: the legendary "[http://www.techradar.com/us/news/phone-and-communications/mobile-phones/samsung-tipped-to-add-liquid-cooling-to-the-samsung-galaxy-s7-1310567|liquid cooling|new_window=true]" system in the S7.
[* black] It's a tiny copper twig.
[* icon_note] Actually, it's a ''teeny'' [https://en.wikipedia.org/wiki/Heat_pipe|heat pipe|new_window=true] with(thin copper bar)with less than half a gram of material, measuring less than half a millimeter thick.
[* icon_note] Actually, it's a ''teeny'' [https://en.wikipedia.org/wiki/Heat_pipe|heat pipe|new_window=true] with(thin copper bar)with less than half a gram of material, measuring less than half a millimeter thick.
[* black] This may not be as revolutionary [https://youtu.be/O6KeASdz2AI?t=25m42s|as Samsung describes it|new_window=true], but most heat pipes ''do'' technically use liquid to transfer heat.
[* black] In the case of the S7, we're guessing that the pipe transfers heat to the phone's metal midframe, where it can then radiate out to the side—''or directly into your hands''.
[* black] We've seen heat pipes in phones before, but the growing need for them shows how phone processors are getting faster (and sometimes hotter) each year.