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Alterações no passo #11

Edição por Andrew Optimus Goldheart

Edição aprovada por Andrew Optimus Goldheart

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-[* black] We spudge off some sticky foam screw coverings and remove the heat sink to find ... goopy thermal paste. Functional, but maybe overzealously applied on our unit.
-[* black] The heat sink itself has a new shape, but retains the standard copper shield and numerous slats; these increase the surface area available, allowing more heat to escape.
+[* black] We spudge off some sticky foam screw coverings and remove the heat sink to find...goopy thermal paste.
+[* icon_note] As Apple rolls out Intel's new Haswell processors and Iris Graphics, we're seeing a massive heat sink consolidation trend—the CPU and GPU now live on the same chip, and get to share a heat sink pad, making for a cleaner and more streamlined design.