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Alterações no passo #8

Edição por Andrew Optimus Goldheart

Edição aprovada por Andrew Optimus Goldheart

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[* black] Prominent ICs on the front and back of the motherboard:
[* red] Two Samsung [link|http://www.samsung.com/global/business/semiconductor/file/product/ds_k4b4g1646b_rev10-1.pdf|K4B4G1646B|new_window=true] 2 Gb DD3 SDRAM modules (2 x 2 Gb for 1 GB total)
[* orange] SMSC [link|http://www.smsc.com/Products/USB/USB_to_Ethernet_Controllers/Standalone_USB_to_Ethernet_Controllers/LAN9500_LAN9500A|LAN9500A|new_window=true] Hi-Speed USB 2.0 to 10/100 Ethernet Controller
[* yellow] Texas Instruments [link|http://www.ti.com/lit/ds/symlink/tps659110.pdf|TPS659110|new_window=true] Integrated Power Management Unit
[* green] AzureWave AW-NH660 Wireless Module
[* blue] Nvidia [link|http://pdadb.net/index.php?m=cpu&id=a333t&c=nvidia_tegra_3_t33|T33-P-A3|new_window=true] Tegra 3 Quad-CoreMulti-Core CPU
[* blue] Nvidia [link|http://pdadb.net/index.php?m=cpu&id=a333t&c=nvidia_tegra_3_t33|T33-P-A3|new_window=true] Tegra 3 Quad-CoreMulti-Core CPU
[* violet] Kingston [link|http://legacy.kingston.com/emmc/MKF_489_19nm_emmc_flyer.pdf|KE4CN3K6A|new_window=true] 8 GB eMMC (eMMC integrates a NAND flash memory and a controller chip in a single package)