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Alterações no passo #9

Edição por Taylor Dixon

Edição aprovada por Taylor Dixon

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-[* black] Thermal pads aside, let's get to those chips! On the front side of these motherboards (top: S10e, bottom: S10), we spot:
+[* black] Thermal pads and cameras aside, let's get to those chips! On the front side of these motherboards (top: S10e, bottom: S10), we spot:
[* red] S10e: 128 GB [https://business.toshiba-memory.com/en-us/product/memory/mlc-nand/ufs.html|Toshiba|new_window=true] UFS NAND flash storage
[* red] S10: 512 GB [https://www.samsung.com/semiconductor/estorage/eufs/KLUFG8R1EM-B0C1/|Samsung|new_window=true] eUFS NAND flash storage
[* orange] Samsung [https://www.samsung.com/semiconductor/dram/lpddr4x/K3UH7H70AM-AGCL/|K3UH7H70AM] LPDDR4X layered over Qualcomm [https://www.qualcomm.com/products/snapdragon-855-mobile-platform|Snapdragon 855|new_window=true] SoC
[* yellow] Qualcomm [https://www.qualcomm.com/products/wcd9341|WCD9341|new_window=true] audio codec
[* green] Qorvo 78062, likely a [https://www.qorvo.com/applications/mobile-products/rf-fusion|RF Fusion|new_window=true] front-end module
[* light_blue] Maxim MAX77705C PMIC
[* blue] Skyworks 78160-5