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Alterações no passo #9

Edição por Taylor Dixon

Edição aprovada por Taylor Dixon

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[* black] Before we can get a look at what makes these phones tick, we dispose of the curious new thermal pad covering the large shields below the SIM tray.
[* icon_note] Maybe some info about this if it's interesting
[* black] Thermal pads aside, let's get into the good stuff. On the front side of these motherboards (top: S10e, bottom: S10), we spot:
[* red] Maxim MAX77705C (probably a PMIC)
[* orange] S10e: 128 GB [https://business.toshiba-memory.com/en-us/product/memory/mlc-nand/ufs.html|Toshiba UFS NAND flash storage]
[* orange] S10: 512 GB [https://www.samsung.com/semiconductor/estorage/eufs/KLUFG8R1EM-B0C1/|Samsung eUFS NAND flash storage]
- [* yellow] Samsung K3UH7H7 LPDDR RAM layered over Qualcomm [https://www.qualcomm.com/products/snapdragon-855-mobile-platform|Snapdragon 855|new_window=true] SoC
+ [* yellow] Samsung [https://www.samsung.com/semiconductor/dram/lpddr4x/K3UH7H70AM-AGCL/|K3UH7H7] LPDDR4X layered over Qualcomm [https://www.qualcomm.com/products/snapdragon-855-mobile-platform|Snapdragon 855|new_window=true] SoC