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Alterações no passo #7

Edição por Jeff Suovanen

Edição aprovada por Jeff Suovanen

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[* black] Taking a peek beneath the motherboard, we make a couple ''cool'' observations.
-[* black] That massive copper vapor chamber under the board is ''much'' beefier than [https://d3nevzfk7ii3be.cloudfront.net/igi/CiZqQr3PttPN1NeB.huge|the one in the S9|new_window=true]—it looks more like [guide|112412|the one we found in the Note9|stepid=215070|new_window=true].
+[* black] That massive copper heat pipe under the board is ''much'' beefier than [https://d3nevzfk7ii3be.cloudfront.net/igi/CiZqQr3PttPN1NeB.huge|the one in the S9|new_window=true]—it looks more like [guide|112412|the one we found in the Note9|stepid=215070|new_window=true].
[* black] Meanwhile, we peel off an additional, multi-layer piece of thermal interface material from the board. All that copper makes a great, big, flat surface, for better thermal transfer—but it's soft metal, so you need this soft interface to fill in any gaps that might otherwise kill performance or overheat your phone.
[* black] This thin sticker ''also'' seems to provide some RF shielding, as there's a big hole in the can lid underneath—where we find a PMIC and a big pink thermal pad.
[* black] TL;DR: We surmise that fast charging + reverse wireless charging puts some serious thermal stress on the electronics in this system. Samsung has pulled out all the stops to cool it off.