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Alterações no passo #7

Edição por Sam Goldheart

Edição aprovada por Sam Goldheart

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[* black] Taking a peek beneath the motherboard, we make a couple ''cool'' observations:
[* black] There's a massive copper heat pipe running alongside the battery. It's a whole lot wider than [https://d3nevzfk7ii3be.cloudfront.net/igi/CiZqQr3PttPN1NeB.huge|last year's|new_window=true], probably to help with the extra heat coming off the wireless charging coils.
- [* black] Up against the copper heat pipe on the motherboard is a new thermal management pad. There must be something important going on under there!
-[* black] Before we can get a look at what makes these phones tick, we dispose of the curious new thermal pad covering the large shields below the SIM tray.
-[* icon_note] This pad most likely pulls double duty, both enhancing the copper heat pipe's ability to manage the heat coming off the hot chips, and performing some RF shielding.
+ [* black] Up against the copper heat pipe on the motherboard is a brand new gray thermal management sheet.
+[* black] Peeking under that sheet we find it's carrying some hefty thermal pads, a neat application we haven't seen before.
+ [* icon_note] This sheet most likely pulls double duty, both enhancing the copper heat pipe's ability to manage the heat coming off the hot chips, and performing some RF shielding.