Ir para o conteúdo principal

Alterações no passo #7

Edição por Taylor Dixon

Edição aprovada por Taylor Dixon

Antes
Depois
Sem alteração

Linhas de Passo

[* black] Taking a peek beneath the motherboard, we make a couple ''cool'' observations:
[* black] There's a massive copper heat pipe running alongside the battery. It's a whole lot wider than [https://d3nevzfk7ii3be.cloudfront.net/igi/CiZqQr3PttPN1NeB.huge|last year's|new_window=true], probably to help with the extra heat coming off the wireless charging coils.
- [* black] The biggest chips got a nice new coat of thermal compound. This hints that the S10's silicon might be running a bit hot this year.
+ [* black] Up against the copper heat pipe on the motherboard is a new thermal management pad. There must be something important going on under there!
[* black] Removing the cameras we spy some yellow plastic housing that looks distinctly 80's. Could it be some kind of retro shock absorber?
[* black] The S10 gets one more camera than the S10e—a telephoto—and sticks it on the same connector as the wide-angle camera.
[* icon_note] This year's codename is "Beyond" an upgrade from last year's ~~infinity~~ "[guide|104308|Star|stepid=195677|new_window=true]".