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Alterações no passo #7

Edição por Adam O'Camb

Edição aprovada por Adam O'Camb

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-[* black] We pause for a brief moment on our way to some chip ID to glance at what lies beneath the motherboard. We make a couple observations:
- [* black] Copper heat pipe looks bigger this year
- [* black] New thermal pad thing where the copper meets the mobo
+[* black] We pause for a brief moment on our way toward the chips to glance at what lies beneath the motherboard. We make a couple observations:
+ [* black] There's a massive copper heat pipe running alongside the battery. It doesn't look as long as last year's, but it's much wider.
+ [* black] This year, the biggest chips get a nice new coat ... of thermal compound. This, combined with the souped-up heat pipe, might mean the S10's silicon is running a bit hotter this year.
[* black] cameras are encased in some 1980's-lookin yellow plastic
[* black] Next the cameras come off the motherboards. As always, Samsung had a lot to say about these cameras.