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Edição por Arthur Shi

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[* black] Taking a peek beneath the motherboard, we make a couple ''cool'' observations:
[* black] There's a massive copper heat pipe running alongside the battery. It's a whole lot wider than [https://d3nevzfk7ii3be.cloudfront.net/igi/CiZqQr3PttPN1NeB.huge|last year's|new_window=true], probably to help with the extra heat coming off the wireless charging coils.
[* black] Up against the copper heat pipe on the motherboard is a new thermal management pad. There must be something important going on under there!
-[* black] Removing the cameras we spy some yellow plastic housing that looks distinctly 80's. Could it be some kind of retro shock absorber?
-[* black] The S10 gets one more camera than the S10e—a telephoto—and sticks it on the same connector as the wide-angle camera.
-[* icon_note] This year's codename is "Beyond" an upgrade from last year's ~~infinity~~ "[guide|104308|Star|stepid=195677|new_window=true]".
+[* black] Before we can get a look at what makes these phones tick, we dispose of the curious new thermal pad covering the large shields below the SIM tray.
+[* icon_note] This pad most likely pulls double duty, both enhancing the copper heat pipe's ability to manage the heat coming off the hot chips, and performing some RF shielding.

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