Histórico do passo nº 8 do guia Samsung Galaxy S9 Teardown - iFixit

Alterações no passo nº 8

Edição por Adam O'Camb — 16 de mar de 2018

Edição aprovada por Adam O'Camb

: Antes
: Depois
: Sem alteração

Linhas do passo

	[* black] Lets take a look at the chips that power all that fancy hardware:
	[* red] Samsung [http://www.samsung.com/semiconductor/dram/lpddr4x/K3UH5H50MM-AGCJ/\|K3UH5H5-OMMAGCJ\|new_window=true] 32 Gb (4 GB) LPDDR4X DRAM, layered over a [https://www.qualcomm.com/products/snapdragon-845-mobile-platform\|Qualcomm Snapdragon 845\|new_window=true]
	[* orange] Toshiba [https://toshiba.semicon-storage.com/eu/product/memory/nand-flash/mlc-nand/ufs.html\|THGAF8G9T43BAIR\|new_window=true] 64 GB UFS (NAND flash + controller)
	[* yellow] Avago AFEM-9096
	[* green] Qualcomm Aqstic [https://www.qualcomm.com/solutions/mobile-computing/features/aqstic\|WCD9341\|new_window=true] audio codec
	[* light_blue] Maxim MAX77705F PMIC
	[* blue] Skyworks 13716
-	[* violet] IDT P9320S wireless power receiver likely similar to the [https://www.wirelesspowerconsortium.com/products/details/1794/p9320-tri-mode-receiver\|P9320]
+	[* violet] IDT P9320S wireless power receiver likely similar to the [https://www.wirelesspowerconsortium.com/products/details/1794/p9320-tri-mode-receiver\|P9320\|new_window=true]