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The iPhone X has been dropped and can’t work normally. After restoring, the phone can’t be activated. Next, we try to activate the phone with 3uTools.
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Connect the phone to the computer and open 3uTools. Click Activate Now and Start.
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The activation normally takes several minutes. After about 20 minutes, the phone is stuck in the activation interface. The phone is still unable to be activated.
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Clear thermal grease with a Sculpture Knife.
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After separation, it is found that there are many missing pads. Then we restore useful pads from missing pads with jumper wires.
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Attach the logic board to the holder and remove tin on the bonding pad with Soldering Iron at 365 °C and Solder Wick.
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Apply some Solder Paste to the missing pads and apply tin with Hot Air Gun at 340 °C. Clean the bonding pad with PCB Cleaner and apply some Paste Flux.
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Solder 0.02 mm copper wires to the bonding pad with Soldering Iron. Please be noted that copper wires must be soldered firmly.
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Clean with PCB Cleaner again and curl the copper wires to make pads with Tweezers and Sculpture Knife.
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Apply Solder Mask to the bonding pad to fix the copper wires and solidify the solder mask with UV Lamp for 5 minutes.
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Scrape away excess solder mask with Sculpture Knife to show the copper wires.
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Next, remove tin on the bonding pad with Soldering Iron at 365 °C and Solder Wick. Clean the bonding pad with PCB Cleaner.
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Put the motherboard on the 165 °C Heating Platform to heat.
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After the solder balls are formed, turn the power off and cool the signal board. Apply some Paste Flux and align the logic board with the signal board.
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Keep heating for 1 minute when the temperature reaches 165 °C. Turn the power off and cool the motherboard.
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To reassemble your device, follow these instructions in reverse order.
To reassemble your device, follow these instructions in reverse order.
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