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Lançado em 4 de novembro de 2017. Modelo A1865, A1901. Disponível como GSM ou CDMA / 64 ou 256 GB / Prateado ou Cinza Espacial. (Pronuncia-se “iPhone 10”.)

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iPhone X long screw damage/RF board component transplant

The RF board has long screw damage causing sound and performance issue. The PCB has so many layers which means it’s almost impossible to trace and connect the missing links. Can the RF chips be transferred to other RF working board? My assumption is only LTE, WiFi and Bluetooth chips are necessary to be transferred. Please let me know your thoughts.

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IPhone X has two boards fused (main board and RF Board) My issue is within the circuitry of the RF board. Would it not cause issues when the RF boards are swapped? RF board has LTE, WiFi modem etc which might be hard-coded to the main CPU. If I can borrow a working RF board and transfer the important chips, my issue will be sorted. The question is if it can be done, what are chips that needs transferring? It’s impossible to move everything including caps and registers.

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I’m not sure I understand your question. If you have another working board, why would you move the RF chips? The only time you need to move chips is when you want to maintain the data on an otherwise non-working board. In that case, you would transfer over the CPU, BBCPU, NAND and EEPROM (as well as the Home Button).

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