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iPhone de quarta geração lançado em 2010. O reparo é simples, mas o vidro frontal e o LCD devem ser substituídos juntos, como uma unidade. GSM / 8, 16 ou 32 GB de capacidade / Modelo A1332 / Preto e Branco.

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Question about reball skywork chip

is there thermal grease between both parts of the chip?

or is it done by cleaning the gold shining surface and reball it?

http://cdn.smartphone-parts.com/images/T...

got the same problem with the chip, it broke into pieces

Skyworks SKY77541 module soldering

in the meantime, the new chip arrived and I will try to solder this

desolder the nonfunctioning chip. there seems to be only solder on the outside. but what about the contact sufaces in the middle?

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Thx for information oldturkey

think my chip is broke into two pieces :(

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Unusual. Take a couple of images and post them with your original question, lets see:-)

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okay

I have not reballed already because I'm not sure if the big surfaces are coated with solder or with something else?

has anyone had experience with it already?

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There is only one part. Your image shows the front and back of the chip. Here are some great instructions about reballing a BGA. Also check this video, different chip, same idea. The stencils for a reball are available at places like this. Hope this helps, good luck.

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