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Mensagem original de: Minho ,


Your pictures aren't very clear but from what I can see, those look like pulled pads. If that is the case, then compare that with the picture below. Any blue pads are NC (not connected) so you can ignore them. Any other pad will require micro-jumpers.

Pulling an IC before all of the solder is molten will pull pads. You have to insure the IC floats on the molten solder. You can do this by gently tapping the IC to see if it springs back. Also, avoid wicking. These pads are simply too small and have very little adhesive and copper holding them in place. The IC will have to be reballed.